Thermal conductivity and Seebeck coefficient characterization for thermoelectric films（2）

第六届海内外中华青年材料科学技术研讨会（2015）——Thermoelectric(TE)thin/thick films have promising applications in micro generators for low-power electronic devices such as wireless sensor nots. Characterizations of thermal and electrical properties of TE films are much more challengeable than bulk materials due the low thickness of the material and the substrate influences. Thermal conductivity and Seebeck coefficient of TE films are always measured in different directions, which can lead to mistake in TE property evaluation and structure-property correlation of TE films. In this work, we introduce an isodirectional characterization of thermal conductivity and Seebeck coefficient of Bi2Te3 TE films by using a differential 3 -method and a potential Seebeck microprobe (PSM), respectively. The thermal and electrical properties are measured both in the cross-plane direction.The effects of the film thickness and the substrate on the both TE parameters are evaluated.

关键词： thermal conductivity;seebeck coefficient;thermoelectric films 第六届海内外中华青年材料科学技术研讨会（2015）

主讲人：Prof. Aijun Zhou 机构：University of Electronic Science and Technology of China

时长：0:12:49 年代：2015年